Phone: +44 (0)1460 61791 Email: sales@epakelectronics.com
Epak Electronics Ltd stock a wide selection of the Comco abrasive powder and can source any not in stock quickly and easily.
We have many types of abrasive available, the ones listed below are the most commonly requested types and sizes. If you want a different size or type of abrasive powder not listed here, please do not hesitate to contact us.
Below have given a brief overview of the abrasive powders and some common applications for each of the abrasive types.
We have been selling the Comco range of abrasive blasting equipment for over 40 years and can help assist with any queries or questions you may have.
For see the range of micro abrasive blast equipment available from Comco Inc please have a look here.
Aluminium Oxide is one of the most commonly used abrasive powders for cutting and surface etching. The shape and hardness characteristics of aluminium oxide makes it ideal when working with metals and harder materials. It is commonly used for cutting, de-burring and the preparation of surfaces.
Aluminium Oxide is recommended for the following applications: Cleaning ceramic substrates, Removal of inked markings, Component failure analysis, Removing bridging between traces, Cleaning magnesium oxide from thermocouples, Etching of heat-sensitive materials, Clean up of laser drilled holes, Texturing graphite surfaces, Silicon wafer bevelling.
Particle Sizes: 10 Micron, 17.5 Micron, 25 Micron, 50 Micron and 150 Microns Particle Shape : Blocky & Sharp Hardness (Mohs’) : 9
Crushed Glass is manufactured by crushing glass beads.
The result is a mild abrasive media that’s used where only a light degree of abrading is desired.
Particle Size: 50 Microns Particle Shape : Blocky & Sharp Hardness (Mohs’) : Between 5 and 6
Glass Bead media is typically used when parts being processed need to retain tight tolerances. Glass bead abrasive can also be used to perform light de-burring or to create a satin finish on the surfaces or parts. The spherical shape of the glass bead keep it from cutting into the surface of the part so it’s commonly used to relieve stresses by “pounding” the part’s surface. The result is a mild abrasive media that’s used where only a light degree of abrading is desired.
Recommended for the following applications: For cosmetic use on component metal surfaces or board edges, Demarking plated components without damaging component finish
Particle Size: 35, 50 and 50 Microns Particle Shape : Spherical Hardness (Mohs’) : 6
Plastic Media abrasive is obtained by grinding and carefully sizing recycled plastic. It comes in two main sizes (50 micron and 200 micron) but different types of plastics are available. Its size makes it an effective tool to deburr machined parts without causing dimensional changes. Plastic can also be used to remove conformal coatings and coatings without damaging circuit boards (PCBs).
Recommended for the following applications: Deburring Delrin ® / Teflon® / nylon devices, Deflashing plastic connectors, Stripping wire insulation & Removing conformal coating
Particle Size: 50 and 200 Microns Particle Shape : Blocky Hardness (Mohs’) : Between 2 and 4
Pumice is a very soft abrasive, it is used where delicate parts need to have areas abraded but surface damage must be kept to a minimum.
Particle Size: 75 Micron Particle Shape : TBA Hardness (Mohs’) : TBA
Silicon Carbide abrasive is used when you want to cut through parts - ideal for drilling holes and cutting grooves in substrates.
Particle Size: 20 and 50 Micron Particle Shape : TBA Hardness (Mohs’) : TBA
Sodium Bicarbonate is one of the softest abrasives available but because of the “monoclinic” shape, it excels when abrading more pliable materials. The particles cut through soft surfaces where a blockier particle would tend to bounce off. It is commonly used to selectively remove coatings on circuit boards without damaging components. It also gets used for a lot of medical device manufacturing as the abrasive will dissolve in water removing any contaminant with it.
Recommended for the following applications: Removing solder mask, Removal of inked markings on plastic materials, Removing conformal coating, Removal of epoxy on electronic test probe ID's, Deburring Delrin ® / Teflon® / nylon devices, Cleaning ceramic surfaces, Stripping wire insulation
Particle Size: 50 and 100 Micron Particle Shape : Monoclinic Hardness (Mohs’) : Between 3 and 4
Walnut Shell is manufactured by grinding nut shells. It has a much larger size than sodium bicarbonate, but is also used to remove (polymer) coatings from circuit boards without damaging traces or components. It’s also used to deflash plastic parts.
Recommended for the following applications: Removing solder mask, Stripping wire insulation, Removing conformal coating, Removal of inked markings on plastic materials, Deburring Delrin ® / Teflon® / nylon devices
Particle Size: 250 Micron Particle Shape : Blocky Hardness (Mohs’) : Between 3 and 4
Wheat Starch media is a very mild abrasive with a MoH hardness rating of 2. The soft shard shard-like edges of wheat starch is used where a delicate blast is needed to remove coatings and contamination without harming the underlying surface.
Particle Sizes: 100 Micron Particle Shape : Blocky, Sharp, Crystaline Hardness (Mohs’) : 2
Powder and Nozzle Datasheet
Powder and Nozzle Datasheet
Powder and Nozzle Datasheet
Powder and Nozzle Datasheet
Powder and Nozzle Datasheet
Powder and Nozzle Datasheet
Powder and Nozzle Datasheet
Powder and Nozzle Datasheet
Powder and Nozzle Datasheet
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