Phone: +44 (0)1460 61791 Email: sales@epakelectronics.com
We are the UK and Ireland agents for Small Precision Tools (SPT). We can supply die pickup tools, wire bonding wedges, wire bonding capillaries, EFO wands, epoxy stamping and dispensing nozzles, capillary unplugging wires, ribbon wire bonding tools, TAB and Waffle bonding tools, die collets for active face die, peripheral edge pickup tools and a wide range of custom solutions is also available.
You can find the products we supply using the main drop down menu above or by links at the bottom of the page.
Whether you are picking up small SMD devices to active face die with air bridges, SPT can provide a solution for all your die bonding needs. SPT have solutions that work with nearly all die bonder manufacturers and can even fabricate special/custom solutions.
Die Pickup Tools Overview CT Conical Die Pickup Tools 2151-CT Threaded Replaceable Conical Tip Pickup Tools RT Rectangular Pickup Tips RTR/HRTR Rectangular Rubber Pickup Tips RPCT Replaceable Plastic Pickup Tools FCTR/PCTR Pure Conical Tip Rubber Pickup Tools RTR-D2/RTR-D3 Fragile Die Pickup Tools 2 Sided Die Collets 4 Sided Die Collets PL Peripheral Edge Die Collets SC & HSC Suction Cup Pickup Tools ST Silicone Tip Pickup Tools Special / Custom Die Pickup Tools Available Shank Styles and Tip HoldersEpoxy stamping uses a patterned surface to transfer a calculated quantity of adhesive, solder paste or viscous material. This can be in the shape of a grid, round, rectangular or even star shaped pattern depending on the application, the nature of the material being transferred and the size and area of the desired transfer point.
Epoxy Stanping ToolsEpoxy dispensing needles are used with either manual or automated positive pressure displacement dispensing systems. Designed to control the area of the material being dispensed, SPT offer a wide range of nozzles to accommodate most dispensing applications.
Epoxy Dispensing NozzlesPush up needles, designed to be used in die eject systems for removing die and components mounted to a backing tape.
PUN - Push Up NeedlesWire bonding capillaries used to connect the internal circuitry in die and semiconductors to the external world. Normally the fine wire that ranges in size from 18 to 33 microns in diameter is gold or increasingly these days, copper wire. SPT uses a high density alumina ceramic material for their bonding capillaries and a Zirconia composite (AZ) material for ultra fine pitch applications.
Wire Bonding Capillary Tool Overview UT Non-fine Pitch Capillaries QFN Package Copper and Gold Wire Bonding Capillaries SU Copper Wire bonding Capillary SI Enhanced Stitch Bondability PI Advanced Bonding Application Capillaries AZR Long Life Material for CU Wire Bonding Infinity 3X Long Life Tools BSOB Ball Stitch On Ball Capillaries SBB Stud Ball Bumping Capillaries Special Capillary Taper Designs CUW Capillary Unplugging Wire EFO Wands Capillary Bonding Window Clamps and Heater BlocksUltrasonic bonding wedges have been used in the semiconductor industry for a long time. The aluminium or gold wire used is ultrasonically welded between the semiconductor chip to the external package or IC leads with a fine wire that is typically between 13 to 75 microns in diameter. Tools are made from Titanium Carbide, Tungsten Carbide or related materials.
FP Fine Pitch Series Bonding Wedge UT Universal Bonding Wedge COB Chip-on-board Bonding Wedges ABT Autobonding Tool Bonding Wedges Slimline Notch Bonding Wedges Microwave Bonding Wedges Ribbon Wire Bonding Wedges Double X Groove Single point TAB Bonding Tools (7000/7100) Double X Groove Single Point-TAB Tools (7500/7600) Waffle Foot TAB Bonding Wedge (7045/7145) Side Wire Bonding Wedge (1008A) Insulated Wire Bonding Wedge (XGR) Thermocompression Bonder Needles (PF) Large Wire No-Hole Inline U-Groove Tools (CK) Large Wire No-Hole Inline V-Groove (CKVD) Large Wire No-Hole Inline V-Groove (LWD6) Orthodyne Style Inline V-Groove (OSG7) Back Bonding Wedge (1001/1002/1110) Large Wire 45° Feed Hole Inline V-Groove (45CK) Inline Groove Autobonding Tool (AB16) Inline Groove Notch Tool (3016/4516) Hole Inline V-Groove (30D6/45D6/60D6) Inline U/V-Groove (1015A/2015A/1016A/2016A) Microloy Osmium-Carbide AlloyIf you can't find what you are looking for, please do not hesitate to contact us at sales@epakelectronics.com
Production equipment including micro abrasive blast equipment, soldering machines, steam aging test equipment, radiometers for UV measurement, C02 Spray Cleaning Equipment.
We have a range of high reliability chip resistors, networks, attenuators and MOS chip capacitors and electronic packages from MSI.
Wire bonding tools, bonding capillaries, die pickup tools, epoxy dispensing and stamping tools and bonder accessories.
UV Equipment, UV Filters, UV Measurement Labels and Radiometers, UV Cure Chamber, UV Lamps, Spot Cure Lamps, Ink Coating and Printing Supplies, Drawdowns, Ink Proofing, Spatulas, Scrapers and Ink Knives
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