Phone: +44 (0)1460 61791 Email: sales@epakelectronics.com
We are the UK and Ireland agents for Small Precision Tools (SPT).
SPT (Small Precision Tools) offer a superb range of wire bonding capillaries and wire bonding wedges. Also available is a range of accessories such as capillary unplugging wire and capillary unplugging probes, epoxy stamping tools, EFO-wands, push up needles (die eject probes), and die shear tools.
Die Pickup Tools Dispensing Nozzles and Epoxy Stamping Tools Wire Bonding Capillaries Wire Bonding Wedges
SPT capillaries can be used on any of the following bonding machines:
ASM, CHO, F & K Delvotek, Hybond, H & K, K & S, MEI, Orthodyne, Palomar, West Bond, and many other bonders.
No problem, we can offer equivalent parts, just contact us for a no obligation quote.
Wire bonding capillaries used to connect the internal circuitry in die and semiconductors to the external world. Normally the fine wire that ranges in size from 18 to 33 microns in diameter is gold or increasingly these days, copper wire. SPT uses a high density alumina ceramic material for their bonding capillaries and a Zirconia composite (AZ) material for ultra fine pitch applications.
Wire Bonding Capillary Tool Overview UT Non-fine Pitch Capillaries QFN Package Copper and Gold Wire Bonding Capillaries SU Copper Wire bonding Capillary SI Enhanced Stitch Bondability PI Advanced Bonding Application Capillaries AZR Long Life Material for CU Wire Bonding Infinity 3X Long Life Tools BSOB Ball Stitch On Ball Capillaries SBB Stud Ball Bumping Capillaries Special Capillary Taper Designs CUW Capillary Unplugging Wire CUP Capillary Unplugging Probes EFO WandsIf you can't find what you are looking for, please do not hesitate to contact us at sales@epakelectronics.com
Production equipment including micro abrasive blast equipment, soldering machines, steam aging test equipment, radiometers for UV measurement, C02 Spray Cleaning Equipment.
We have a range of high reliability chip resistors, networks, attenuators and MOS chip capacitors and electronic packages from MSI.
Wire bonding tools, bonding capillaries, die pickup tools, epoxy dispensing and stamping tools and bonder accessories.
UV Equipment, UV Filters, UV Measurement Labels and Radiometers, UV Cure Chamber, UV Lamps, Spot Cure Lamps, Ink Coating and Printing Supplies, Drawdowns, Ink Proofing, Spatulas, Scrapers and Ink Knives
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