Microwave devices commonly have bonding pads as small as .001”/ 25µm square. They are typically bonded with .0005”/13µm to .001”/25µm diameter gold wires. Microwave devices have some special requirements that are not seen in monolithic devices special requirements include the variety of chips within the package, step heights within the products that require deep access requirements, as well as critical loop shapes for tuning of the device. We have developed a range of tools to meet the small foot print, and critical loop requirements.
Available in 30°, 38°, 45°, 50° and 60° wire feed angles
ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS & QUANTIY FOR QUOTE OR ASSITANCE)
Part Number - M Wedge
Part Number - VM - Vertical Hole Shank M Wedge
Part Number - JM - Special Clearance For Vertical Hole Shank M Wedge
Part Number - HM - Double Flat Shank M Wedge
Part Number - PM - Double Flat Shank - Enhanced Transducer M Wedge
Part Number - M-180-DEG-REV -180 Degree Reversed Shank WedgeM Microwave Wedge Tool DatasheetSPT Wedge Shank Styles Datasheet
BONDING WEDGES & TOOLS WE OFFER:
FP FINE PITCH SERIES WEDGE
UT UNIVERSAL BONDING WEDGE
COB CHIP ON BOARD WEDGES
ABT AUTOBONDING TOOL WEDGES
SLIMLINE NOTCH BONDING WEDGES
MICROWAVE BONDING TOOLS
RIBBON WIRE BONDING WEDGES
DOUBLE X GROOVE SINGLE POINT-TAB TOOL (7000/7100)
DOUBLE X GROOVE SINGLE POINT-TAB TOOL (7500/7600)
WAFFLE FOOT TAB BONDING WEDGE (7045/7145)
SIDE WIRE BONDING WEDGE (1008A)
INSULATED WIRE BONDING WEDGE (XGR)
THERMOCOMPRESSION BONDER NEEDLES (PF)
LARGE WIRE NO-HOLE INLINE U-GROOVE (CK)
LARGE WIRE NO-HOLE INLINE V-GROOVE (CKVD)
LARGE WIRE NO-HOLE INLINE V-GROOVE (LWD6)
ORTHODYNE STYLE INLINE V-GROOVE (OSG7)
BACK BONDING WEDGE (1001/1002/1110)
LARGE WIRE 45° FEED HOLE INLINE V-GROOVE (45CK)
INLINE GROOVE AUTOBONDING TOOL (AB16)
INLINE GROOVE NOTCH TOOL (3016/4516)
HOLE INLINE V-GROOVE (30D6/45D6/60D6)
INLINE U/V-GROOVE (1015A/2015A/1016A/2016A)
MICROLOY OSMIUM-CARBIDE ALLOY
BONDING CAPILLARIES FROM SPT