UT Series - Chip-On-Board (COB) Wire Bonding Tools
Chip-On-Board technology is successfully used to connect semiconductors to PCBs for high integration of electronic systems or microsystems. General conditions and procedures of chip and wire bonding are highly developed for standard applications, but new materials , increasing pin numbers, complex system integration processes and demands for higher reliability in low cost throwaway
assemblies and more expensive profile-critical products has led to required improvements in the material, design and life of the tool.
SPT have developed tools in partnership with key OEM’s to meet these demands
The UT Series tools have a 10° back angle (BA - see tool image above)
Available in 30° wire feed angles
ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS & QUANTIY FOR QUOTE OR ASSITANCE)
Part Number - UT Wedge (COB)UT COB Chip On Board Bonding Wedge DatasheetSPT Wedge Shank Styles Datasheet
BONDING WEDGES & TOOLS WE OFFER:
FP FINE PITCH SERIES WEDGE
UT UNIVERSAL BONDING WEDGE
COB CHIP ON BOARD WEDGES
ABT AUTOBONDING TOOL WEDGES
SLIMLINE NOTCH BONDING WEDGES
MICROWAVE BONDING TOOLS
RIBBON WIRE BONDING WEDGES
DOUBLE X GROOVE SINGLE POINT-TAB TOOL (7000/7100)
DOUBLE X GROOVE SINGLE POINT-TAB TOOL (7500/7600)
WAFFLE FOOT TAB BONDING WEDGE (7045/7145)
SIDE WIRE BONDING WEDGE (1008A)
INSULATED WIRE BONDING WEDGE (XGR)
THERMOCOMPRESSION BONDER NEEDLES (PF)
LARGE WIRE NO-HOLE INLINE U-GROOVE (CK)
LARGE WIRE NO-HOLE INLINE V-GROOVE (CKVD)
LARGE WIRE NO-HOLE INLINE V-GROOVE (LWD6)
ORTHODYNE STYLE INLINE V-GROOVE (OSG7)
BACK BONDING WEDGE (1001/1002/1110)
LARGE WIRE 45° FEED HOLE INLINE V-GROOVE (45CK)
INLINE GROOVE AUTOBONDING TOOL (AB16)
INLINE GROOVE NOTCH TOOL (3016/4516)
HOLE INLINE V-GROOVE (30D6/45D6/60D6)
INLINE U/V-GROOVE (1015A/2015A/1016A/2016A)
MICROLOY OSMIUM-CARBIDE ALLOY
BONDING CAPILLARIES FROM SPT