Infinity 3.5 Time Extended Life Bonding Capillaries

Infinity 3.5 Times Longer Tool Life Capillaries from SPT

In wire bonding, load-up on the capillary face is inevitable as the bond touchdown increases. This is mainly due to the scrubbing action of the capillary from the ultrasonic energy applied in the process of making bonds. As the load-up amount increases, bond quality is affected. The useful life of the capillary can be defined as the maximum bond number before the bond quality produced by the capillary is deemed unacceptable. Depending on the types of substrate and bonding condition, the tool life of the capillary can vary from a few hundred thousand bonds to more than 1 million bonds.

A SPT proprietary process has been developed to extend the bonding tool life by at least three times its current limit, utilizing state-of-art controlled high purity process that enhances the sub-surface properties of the ceramic based material. Through various in-house testing and user evaluations, the long life capillary has proven to exceed the current tool life by at least 2 times the standard.

3 million bonds with a capillary ? You can with Infinity - 3.5 Times Longer Tool Life Capillaries from SPT

Failure Rate Distribution as a Function of Tool Life Comparing Infinity and Non-Infinity Capillary

Infinity Overview Of Results

Features:

Long life capillary at least 3X of its original.
No change in the bonding parameters.
Higher mean time before failure (MTBF).
Less bonder downtime; higher production output.

Infinity Added to the SPT Part Number


Capillary Part Number Selection Guide

The capillary design selection guide is always based on specific device & package configuration, wire type, and wire bonder. The selection of capillary part number process is simplified as follows:

Capillary Tip The selection of capillary tip design is determined by the device and metallization, bond pad pitch, bond pad opening, wire size, target mashed ball diameter, and critical loop height to derive the hole diameter(HD), chamfer diameter (CD), chamfer angle (CA), tip diameter (T) and face angle (FA).

Shank Style The shank style selection is characterized by geometrical design of the capillary bonding tool as dictated by specific device and / or package configuration.

Surface Finish The selection of a particular capillary tip surface finish hinges on whether the application is for gold or copper wire bonding.

Material Capillary material selection for optimum tool life performance for a given bonding application.

Wire Type The proper selection of capillary design is a resultant of the various wire bonding considerations.

Fine Pitch Part Number Selection


ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS & QUANTIY FOR QUOTE OR ASSITANCE)
Part Number - Infinity Long Life CapillariesPRICE QUOTE - email us at sales@epakelectronics.com
How To Order Infinity Capillaries
Infinity Long Life Capillary Brochure


BONDING CAPILLARIES & ACCESSORIES WE OFFER:

Non-Fine Pitch Capillaries (UT)UT NON-FINE PITCH CAPILLARIES
QFN (Quad Flat Non-Lead) SQ Capillary for gold and copper wire bondingQFN PACKAGE COPPER & GOLD WIRE BONDING CAPILLARY
Copper Wire Bonding Capillaries (SU)COPPER WIRE BONDING CAPILLARY
Enhanced Stitch Bond CapillariesENHANCED STITCH BONDABILITY
Advanced Bonding ApplicationsADVANCED BONDING APPLICATIONS
AZR Copper Bonding Capillary MaterialAZR LONG LIFE MATERIAL FOR CU WIRE BONDING
INFINITY 3X LONGER TOOL LIFEINFINITY 3X LONGER TOOL LIFE
Ball Stitch On Ball Wire Bonding CapillariesBALL STITCH ON BALL (BSOB)
Stud Ball Bumping (SBB) Bonding CapillarySTUD BALL BUMPING
Several different taper styles are available: One Side Relief, Double Side Relief, 90 Degree Double Side Relief and Vertical Bottle NeckSPECIAL CAPILLARY TAPER DESIGNS
Capillary unblocking and unplugging wireCAPILLARY UNPLUGGING WIRE (CUW)
Capillary unblocking and unplugging needleCAPILLARY UNPLUGGING PROBE (CUP25PB)
EFO Wands for Capillary Bonding by SPTEFO WANDS
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