EFO Wands (EFO)

EFO Free Air Ball Formation (EFO Wand)

The importance of consistent free air ball (FAB) for fine-pitch (FP) and ultra-fine pitch (UFP) bonding applications has led to the development of new alloy material to improve the performance of the EFO wand. Together with a new proprietary process, consistent EFO sparking effect can be achieved with SPT EFO wands. SPT is capable of making customized EFO wands used on different types of bonder with precise dimensions and accuracy.

When a new EFO wand is first installed on the bonder, inconsistent sparking effect normally occurs, causing inconsistent FAB formation. It was also noticed that the spark, during firing tends to sway to the left or right during the initial sparks. This has the tendency to produce a tilted FAB as shown. This effect is mainly due to the inability of the new EFO to lead the current to flow from the same point.

Tilted FAB Effect of the tilted FAB Consistent firing of the EFO
To eliminate such adverse effect, SPT has introduced a proprietary process whereby new EFO wands are subjected to continuous sparking similar to those seen on the bonder. Such process will ensure that the new EFO wands can achieve its desired performance without having to “season” them, thus causing production delay and yield loss.This process can be performed for a wide variety of EFO wands used for different types of bonders currently available in the market.

Advantages:

Consistent free air ball formation & ball shape uniformity
Consistent ball size control.
Ball shape uniformity.
Proprietary process for superior sparking performance.

Note: Other standard or custom models available on request

Example Part Number: EFO - KNS 8028

Standard EFO Wands available for: ASM, K&S, Shinkawa, Kaijo, ESEC, Delvotec, ROHM, KEC and Toshiba bonders

ORDERING INFORMATION (PLEASE ADVISE QUANTIY FOR QUOTE OR ASSITANCE)

ASM:
ASM0309 For Bonder AB309 PRICE QUOTE - email us at sales@epakelectronics.com
ASM0339 For Bonder AB339 & Eagle 60 PRICE QUOTE - email us at sales@epakelectronics.com
ASM339C For Bonder AB339 & Eagle 60 PRICE QUOTE - email us at sales@epakelectronics.com
ASM339D For Bonder iHawk PRICE QUOTE - email us at sales@epakelectronics.com

DELVOTEC:
DEL6200 For Bonder 6200 & 6210 PRICE QUOTE - email us at sales@epakelectronics.com

ESEC:
ESE3000 For Bonder 3006, 3008, 3018 & 3088 PRICE QUOTE - email us at sales@epakelectronics.com
ESE3100 For Bonder 3100 PRICE QUOTE - email us at sales@epakelectronics.com
ESE3101 For Bonder 3100 (Cu + Au Wire) PRICE QUOTE - email us at sales@epakelectronics.com

KAIJO:
KAJ0118 For Bonder FB-118 PRICE QUOTE - email us at sales@epakelectronics.com
KAJ131B For Bonder FB-131 PRICE QUOTE - email us at sales@epakelectronics.com
KAJ137A For Bonder FB-137 PRICE QUOTE - email us at sales@epakelectronics.com
KAJ0170 For Bonder FB-170, FB-180 & FB-190 PRICE QUOTE - email us at sales@epakelectronics.com
KAJ1000 For Bonder FB-1000 PRICE QUOTE - email us at sales@epakelectronics.com

KEC:
KEC180B For Bonder KWB2100 PRICE QUOTE - email us at sales@epakelectronics.com

K&S:
KNS1484 For Bonder 1484 PRICE QUOTE - email us at sales@epakelectronics.com
KNS1488 For Bonder 1488 PRICE QUOTE - email us at sales@epakelectronics.com
KNS1489 For Bonder 1488 PRICE QUOTE - email us at sales@epakelectronics.com
KNS8021 For Bonder 8020 PRICE QUOTE - email us at sales@epakelectronics.com
KNS8028 For Bonder 8028, Maxum & Nutek PRICE QUOTE - email us at sales@epakelectronics.com
KNS8098 For Bonder 8098 Ball Bumper PRICE QUOTE - email us at sales@epakelectronics.com
KNS8128 For Bonder 8028 PRICE QUOTE - email us at sales@epakelectronics.com

ROHM:
RHMBW01 For Bonder ZWBC1 PRICE QUOTE - email us at sales@epakelectronics.com

SHINKAWA:
SHK025A For BonderACB-25 PRICE QUOTE - email us at sales@epakelectronics.com
SHK0035 For Bonder SDW-35 PRICE QUOTE - email us at sales@epakelectronics.com
SHK0200 For Bonder UTC-200 & UTC-205 PRICE QUOTE - email us at sales@epakelectronics.com
SHK0300 For Bonder UTC-300 PRICE QUOTE - email us at sales@epakelectronics.com
SHK400A For Bonder ACB-400 & ACB-450 PRICE QUOTE - email us at sales@epakelectronics.com
SHK1000 For Bonder UTC-1000 PRICE QUOTE - email us at sales@epakelectronics.com
SHK2000 For Bonder UTC-2000 PRICE QUOTE - email us at sales@epakelectronics.com

TOSHIBA:
TOS0943 For Bonder HN943 PRICE QUOTE - email us at sales@epakelectronics.com


ORDERING INFORMATION (PLEASE ADVISE QUANTIY FOR QUOTE OR ASSITANCE)
Standard EFO Wands Datasheet
Standard EFO Wands Brochure


 

BONDING CAPILLARIES & ACCESSORIES WE OFFER:

Non-Fine Pitch Capillaries (UT)UT NON-FINE PITCH CAPILLARIES
QFN (Quad Flat Non-Lead) SQ Capillary for gold and copper wire bondingQFN PACKAGE COPPER & GOLD WIRE BONDING CAPILLARY
Copper Wire Bonding Capillaries (SU)COPPER WIRE BONDING CAPILLARY
Enhanced Stitch Bond CapillariesENHANCED STITCH BONDABILITY
Advanced Bonding ApplicationsADVANCED BONDING APPLICATIONS
AZR Copper Bonding Capillary MaterialAZR LONG LIFE MATERIAL FOR CU WIRE BONDING
INFINITY 3X LONGER TOOL LIFEINFINITY 3X LONGER TOOL LIFE
Ball Stitch On Ball Wire Bonding CapillariesBALL STITCH ON BALL (BSOB)
Stud Ball Bumping (SBB) Bonding CapillarySTUD BALL BUMPING
Several different taper styles are available: One Side Relief, Double Side Relief, 90 Degree Double Side Relief and Vertical Bottle NeckSPECIAL CAPILLARY TAPER DESIGNS
Capillary unblocking and unplugging wireCAPILLARY UNPLUGGING WIRE (CUW)
Capillary unblocking and unplugging needleCAPILLARY UNPLUGGING PROBE (CUP25PB)
EFO Wands for Capillary Bonding by SPTEFO WANDS
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