Wire Bonding Wedges, Ribbon Wire Bonding tools and Waffle TAB bonding tools from SPT (Small Precision Tools).

WIRE BONDING WEDGES FOR GOLD AND ALUMINIUM WIRE

Introduction in Wedge Bonding

The oldest and still commonly used method in semiconductor assembly is wedge-to-wedge wire bonding. SPT was involved in the early development of wedge tool design and presently offers a wide selection depending on the wire size, using Au or Al wire ranging from .0005”-.003”(13µm-76µm), and large Al wire .003”-.020”(76µm-500µm). Tools for ribbon wire and various TAB applications are also available under this product category.

Small Wire Bonding Tools

Fine Pitch Bonding Tool (FP)
Universal Bonding Tool (UT/US)
Chip-On-Board AutoBonding Tool (UT)
AutoBonding Tool (ABT)
Microwave Bonding Tool (M)
Series Slimline Notch Bonding Tools (1100/1200/1300/1400) Back Bonding Wedge (1001/1002/1110)

Large Wire Bonding Tools

No-Hole Inline U-Groove (CK)
No-Hole Inline V-Groove (CKVD)
No-Hole Inline V-Groove (LWD6)
No-Hole Inline V-Groove (OSG7)
Feed Hole Inline V-Groove (45CK)
Feed Hole Inline V-Groove (AB16)
Feed Hole Inline V-Groove (3016/4516)
Feed Hole Inline V-Groove (30D6/45D6/60D6)
Feed Hole Inline U/V-Groove (1015A, 2015A/1016A, 2016A)

Ribbon Wire Bonding Tool

Ribbon Wire Bonding Tools (RW)

Single Point-TAB Bonding Tools

Double Cross Groove (7000/7100)
Double Cross Protrusion (7500/7600)
Waffle Foot (7045W/7145W)

Special Bonding Tools

Side Wire Bonding Wedge (1008A)
Insulated Wire Bonding Wedge (XGA)
PF Manual Thermocompression Bonding Needles

Microloy Osmium-Carbide Alloy

SPT aquired the business activities of Microminiature Technology, Inc. and continues to produce wedges bonding tools with Osmium-Carbide alloy.Check SPT Catalogue for design - and order with Material designation M (Microloy) in place of W, Ti or C.