RPS Photon Solderability Test System

RPS Pulsar Dip and Look Solderability Test System. The Pulsar is a proven industry platform that enables the Dip & Look Solderability Test in accordance with the Mil-STD-202, Method 208. The system features a 15 lb-capacity solder pot, a flux station, and X and Z axis control. Designed for lab environments, the table-top system provides high precision PLC motion control, touch screen programming, and PID temperature management for complete process control of the component dip process.

The Pulsar can be configured with a 2nd solder station, enabling lead and lead-free testing. To certify components for storage beyond 12 months, an Photon Steam Aging System can be used to artificially age the components prior to the solderability dip test.

FEATURES:

Meets Mil-STD-202, Method 208
High Precision ± .002"
Dual Alloy Processing Ready
Precise Process Control and Repeatability
No Programming Knowledge Required

BENEFITS

Easy Set-up & Immediate Results
Precise Process Control & Repeatability
Superior Results vs Hand Dipping
Large Solder Bath Maintains Thermal Mass
Space-Saving Footprint
No Programming Knowledge Required
Meets IPC, ANSI, Mil Specifications

COMBINE WITH STEAM AGER FOR FULL TEST OFFERING

The Pulsar can be combined with a Photon Steam Ager to provide artificial aging prior to the dip and look test. The combination of aging and dip & look testing provides full compliance with the objective IPC, ANSI and MIL solderability test standards.

FEATURES & OPTIONS

PID Temperature Controls
Solder Station & Flux Station
DX with 2nd Alloy Station
Multi-Axis Motion Control
Automatic Dross Wiper
High Precision | ± .01"

SOLDER MANAGEMENT | DUAL ALLOY READY

The solder pot is constructed of a non-contaminating alloy that is extremely durable, stable and lead-free compatible. The solder is presented as a flat and non-turbulent solder surface for minimal dross production. The 15 pound capacity of the solder pot ensures sufficient solder mass for precision process control; a PID temperature controller regulates the solder temperature up to 350°C within ± 5°C of set point.

The Pulsar can be configured with a 2nd solder station to enable lead and lead-free testing, or alternative temperature testing.

PULSAR | SPECIFICATIONS

Control: A PLC & screw drive system manage the robotics. Touch screen controller to write, call and edit programs. Up to 16 programs can be stored in memory. Manual jog capabilities.

Configuration:

Position 1: 1stSolder Station
Position 2: Flux Station
Position 3: 2nd Solder Station (DX Option)

Operation PLC HMI Touch Screen

Accuracy X & Z Axes ± .01" | 0.25mm

Programmability 16 program capacity | unlimited durations

Immersion Depth Programmable in .01” | 0.2mm steps

Speed In | Out: Adjustable 0.04 – 2.0” | 1 – 50 mm per sec
Compliance Standard is 1” | 25mm per sec

Immersion Time Programmable Dwell in Milliseconds

Component Handling Standard & Custom Component Tool Holders

Unit Standard Inches

Rotation Manual Rotation by Operator

Solder Management

Temp Control PID proportioning (0-325°C) ± 5°C

Solder Pot Electro Polished Stainless Steel

Process Range 4 x 6 x 2.5” (W x L x D) 102 x 152 x 64 mm

Alloy Capacity 15 lbs | 6.8 kgs

Lead Free Ready Yes

Static Presentation Standard

Dross Wiper Standard

FLUX MANAGEMENT

Static Vessel Manual Cascade Overflow Method

Dimensions 3.5 x 3.5 x 1” (W x L x D) | 89 x 89 x 25 mm

STANDARDS COMPLIANCE

ANSI-J-STD-002 | JEDEC JESD22-B102D
ANSI-J-STD-003 | MIL-STD-202 Method 208
MIL-STD-883 | IPC/EIA J-STD 002B/C

PHYSICAL

Electrical 100-120 VAC | 1Ø | 50-60 hz | 15 amp (supplied with suitable 230 VAC Transformer)
Safety UL and CE Compliant
Dimensions(WxLxH) 30 x 25 x 19“ | 762 x 635 x 483 mm
Weight 150 lbs | 68 kg