Mini-Systems Inc. Wire Bondable Chip Resistor series offers the design engineer a wide variety of styles with high stability, low TCR and low noise of Thin Film materials to meet the demands of cutting edge design requirements.
Electrical connection to associated circuitry is accomplished through wire bonding to terminations located on the top side of the chip. Suitable die attachment methods are epoxy or eutectic attach.
CASE SIZE | TYPE | LENGTH “/mm | WIDTH “/mm |
LOW VALUES
|
NiCr or [TaN] on Si or Quartz | NiCr of [TaN] on Si or Quartz | POWER Quartz | POWER Si Al2O3 | POWER AlN | POWER BeO |
0201 | 21 | 0.020”(0.508) | 0.010”(0.254) | 1-3 Ohm | 3-350K [500k] | 3-55K [71.5K] |
10mW
|
50mW
|
200mW
|
400mW
|
0202 | 122 | 0.020”(0.508) | 0.016”(0.406) | 1-3 Ohm | 3-1M [1.3M] | 3-75K [97.5K] | 25mW | 125mW | 500mW | 1W |
0302 | 32 | 0.030”(0.762) | 0.020”(0.508) | 1-3 Ohm | 3-1.5M [2M] | 3-200K [250K] | 50mW | 250mW | 1W | 2W |
0402 | 110 | 0.037”(0.940) | 0.017”(0.432) | 1-3 Ohm | 3-2M [3M] | 3-200K [250K] | 25mW | 125mW | 500mW | 1W |
0404 | 4 | 0.040”(1.016) | 0.040”(1.016) |
|
1-7.5M [11M] | 1-500K [650K] | 70mW | 350mW | 1.4W | 2.8W |
0502 | 115 | 0.050”(1.270) | 0.025”(0.635) |
|
3-4.5M [6.5M] | 3-325K [420K] | 50mW | 250mW | 1W | 2W |
0603 | 63 | 0.060”(1.524) | 0.030”(0.762) | 1-3 Ohm | 3-7.5M [11M] | 3-500K [650K] | 100mW | 500mW | 2W | 4W |
0805 | 85 | 0.075”(1.905) | 0.050”(1.270) |
|
1-30M [40M] | 1-2.5M [3.25M] | 100mW | 500mW | 2W | 4W |
1010 | 121 | 0.100”(2.540) | 0.100”(2.540) |
|
1-60M [70M] | 1-4M [5M] | 150mW | 750mW | 3W | 6W |
MSTF118 will continue to be available, size and characteristics similar to MSTF122 MSPR1 will continue to be available, size and characteristics similar to MSTF53 MSMR1 will continue to be available, size and characteristics similar to MSTF101
ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS and QUANTIY FOR QUOTE OR ASSITANCE) Part Number - MSTF SERIES BACK CONTACT RESISTORS Part Number - MSPR1 SERIES BACK CONTACT RESISTORS Part Number - MSMR1 SERIES DUAL BACK CONTACT RESISTORS
MSTF Wire Bondable Thin Film Resistors Datasheet (OLD) MSPR Wire Bondable Thin Film Resistors Datasheet (OLD) MSMR Wire Bondable Thin Film Resistors Datasheet
MOQ is typically 25pcs. Price breaks: 25-49, 50-99, 100-249, 250-499, 500-999, 1000-2499, 2500-4999, 5000-9999, 10K+ Samples may be available on request - please contact us with your requirements to check availability.
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