WIRE BONDABLE MOUNTING PADS AND KITS
These Alumina mounting pads and kits are ideal for providing interconnections and wiring crossovers in the fabrication of "chip and wire" type microelectronic modules. They allow for prototype and small quantity circuitry layouts without the need for special conductor patterns.
SF Style are single pad mounting substrates
DF Style are dual pad mounting substrates
TFR Style are four pad mounting substrates
JKIT Jumper Kit
CKIT Contains Jumpers and Mounting Pad substrates
ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS AND QUANTIY FOR QUOTE OR ASSITANCE)
Part Number - SF1 SERIESSingle Mounting Pad Substrate
Part Number - SF2 SERIESSingle Mounting Pad Substrate
Part Number - DF1 SERIESDual Mounting Pad Substrate
Part Number - DF2 SERIESDual Mounting Pad Substrate
Part Number - TF1R SERIESQuad Mounting Pad Substrate
Part Number - JKITJumper Kit (PLEASE ADVISE REQUIREMENT)
Part Number - CKITJumper & Mounting Pad Kit (PLEASE ADVISE REQUIREMENT)
Mounting Pads & Kits Datasheet
MOQ is typically 25pcs*. Price breaks: 25-49, 50-99, 100-249, 250-499, 500-999, 1000-2499, 2500-4999, 5000-9999, 10K+
Samples may be available on request - please contact us with your requirements to check availability.
*kits are offered individually and also as custom kits. Please enquire for further details.