Group A:

Thermal Shock: MIL-PRF-55342, MIL-STD-202, Method 107 -65°C to +150°C, 5 Cycles, 100%
Element Electrical: MIL-PRF-55342, MIL-STD-202, Method 303 100%
Visual Inspection: MIL-PRF-55342 30X-60X Magnification
Solderability: MIL-PRF-55342, MIL-STD-202, Method 208 95% Coverage After 8 Hours Steam Aging
Resistance to Solvents: MIL-PRF-55342, MIL-STD-202, Method 215 Parts with Color Coded Dots Only
Power Conditioning: (Space Level Only) MIL-PRF-55342, MIL-STD-202, Method 108 100 Hours, 70°C, 1.5X Rated Power, 100%

Group B

Resistance Temperature Characteristics: MIL-PRF-55342, MIL-STD-202, Method 304 -55°C, +25°C,+125°C
Short Time Overload: MIL-PRF-55342 5 Sec., 2.5X WVDC, 6.25X Power Rating
Solder Mounting Integrity: MIL-PRF-55342 Soldered Parts
Bondable Mounting Integrity: MIL-PRF-55342 Epoxy Bondable Parts
Wire Bonding Integrity: MIL-PRF-55342 Wire Bondable Parts

Group C

Life Test: MIL-PRF-55342, MIL-STD-202, Method 108 2,000 Hours, 70°C, Rated Power
Thermal Shock: MIL-PRF-55342, MIL-STD-202, Method 107 -65°C to +150°C, 5 Cycles, Sample
Low Temperature Operation: MIL-PRF-55342 45 Minutes, -65°C, Rated Power
Resistance to Soldering Heat: MIL-PRF-55342, MIL-STD-202, Method 210 Soldered Parts
Resistance to Bonding Exposure: MIL-PRF-55342 Wire and Epoxy Bondable Parts
Moisture Resistance: MIL-PRF-55342, MIL-STD-202, Method 106 Unpowered
High Temperature Exposure: MIL-PRF-55342 100 Hours, 150°C

Class H & K

Element Electrical: MIL-PRF-38534 Per acquisition document
Visual Inspection: MIL-STD-883, Method 2032, Class H & K Class H: Sample Class K: 100%
Wire Bond Evaluation: MIL-STD-883, Method 2011 Wire Bondable Parts

Class K

Temperature Cycling: MIL-STD-883, Method 1010 -65°C to +150°C, 10 Cycles, Sample
Constant Acceleration: MIL-STD-883, Method 2001, Condition B 10,000g
Voltage Conditioning or Aging: MIL-PRF-55342 100 Hours, 70°C, Rated Power
DC Leakage (Capacitors): Not Applicable <5 x 10 Amps at Working Voltage
Dielectric Withstanding Voltage: (Capacitors) MIL-STD-202, Method 301 1.5X Working Voltage, 5 Sec.
Dissipation Factor: (Capacitors) MIL-STD-202, Method 306 1KHz, 1Vrms, +25°C, ≤0.1%
Salt Atmosphere: (Packages) MIL-STD-883, Method 1009 Off Site Testing

Additional Testing

Current Noise: MIL-STD-202, Method 308 Requirements per Value and Material
Device Finish: MIL-PRF-38534 Per Acquisition Document
Die Shear: MIL-STD-883, Method 2019 Requirements per Die Size
Insulation Resistance: (Capacitors) MIL-PRF-49464 ≤10 Ω at working voltage
Q- Factor: (Capacitors) MIL-STD-202, Method 306 1MHz, 50Vrms, 25°C, 1000 Min.
SEM Analysis: MIL-STD-883, Method 2018 Off Site Testing
Temperature Coefficient of Capacitance: MIL-PRF-49464 Per Acquisition Document
Visual Inspection: MIL-STD-883, Method 2017 Sample or 100%

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ISO 9001 Certified. MSI has been a leading manufacturer of Precision Hi-Reliability Chip Resistors for more than 40 Years. Quick response to critical requirements and quick response to questions by knowledgeable sales and engineering staff are keys to providing the unsurpassed service our customers have learned to expect. MSI's products are designed for superior solder fillets for optimum performance in the area of stability, solderability, adhesion, power dissipation and life. Q.P.L. approved to all MIL-PRF-55342 style parts including the /1 part. "S" Failure Rate Qualified. There is no compromise in our effort to manufacture only the best products. Industry leading manufacturing practices have forged the way for MSI's technological superiority. We produce products that are in use in virtually all industries that require precision.