Hybrid Electronics Equipment
We offer several products suited for use in Hybrid Electronics Manufacturing.
Hybrid Electronics is an electronic circuit that is miniaturized and comprises of individual devices, such as semiconductor devices (e.g. transistors and diodes) and passive components (e.g. resistors, inductors, transformers, and capacitors). These are bonded to a substrate or printed circuit board (PCB). Hybrid circuits are often encapsulated in epoxy for protection.
Hybrid circuits work the same was as a single monolithic integrated circuit; the difference between the two types of devices is in how they are fabricated and manufactured. The advantage of hybrid circuits is that components which cannot be included in a normal monolithic IC (or chip) can be used, e.g., capacitors of large value, wound components, crystals, inductors etc.
Related technologies are : Multi-chip module (MCM), Monolithic microwave integrated circuit (MMIC) and Solid Logic Technology (SLT)
Micro Abrasive Blast Equipment
Our range of Comco Microblasters are perfect for cleaning, deburring, texturing and conformal coat removal (for reworking PCBs). Other applications include: Load cells
Components
Mini-Systems Inc supply a range of high reliability resistors, networks, attenuators, bonding islands and jumpers and MOS chip capacitors. There is also a range of QPL qualified parts in use in all manner of electronic devices. The MIL55342 resistors are qualified parts and all MSI parts are made on the QPL production line.
Packages
Mini-Systems Inc also supply a range of alumina/glass wall, electronic packages, lids and T08 Cans for packaging electronic hybrid circuits. Package types include glass wall & metal flat packs, plug-ins, gull wing & J-leaded chip carriers, machine microwave & surface mount microwave packages and TO8 packages.
Adhesives & Thermal Films
We have a range of epoxies, adhesives and thermal management materials that are low stress, high performance materials suited for a huge range of applictions. We have many standard products that are NASA/ESA approved and/or MIL-STD 883C Method 5011.4 Qualified Adhesive Products.AIT offers some of the most advanced Die Attach paste adhesives engineered to improve long-term reliability, rapid inline curing, long pot-life, viscosity and thixotropic control for fast automated dispensing and manufacturing. Some of the following representative products have a demonstrated record of more than 20 years of reliability for military and aerospace applications.
Wire Bonding Tools
We offer SPT's superior range of wire bonding wedges, capillaries and die pickup tools. We offer deep access bonding wedges for assembly in electronic packages, non-contact die pickup tools for placing active face die and wire bonding capillaries using the latest technology for aluminium, gold and copper wire bonding.
Anti-static Products
For safe protection of ESD sensitive devices we have a range of Esion DC plate Anti-static cabinet and Standard Acrylic cabinets fitted with earthed Stainless Steel shelves. These are available in a range of standard and custom sizes to suit your requirements.
C02 Cleaning Equipment
CO2 cleaning and machining technology offers surface and substrate contamination such as particulate matter, outgassing residues, ionics, and heat can be addressed with this technology. Available treatment processes include composite jet spray, centrifugal immersion, supercritical fluid extraction, critical drying, and both vacuum and atmospheric plasma treatment. CO2 technology eliminates or significantly reduces both lean and green waste generation at the production operation level (source) by modifying manufacturing processes such as precision cleaning and machining. Because it is safe and dry, CO2 technology can integrate directly into manufacturing processes and tools to provide in-situ cleaning, thermal control or lubrication.
Micro-abrasive Aerospace Applications