Optical Sealing and Lid-sealing Solutions for Module packaging MEMS

Optical Sealing and Lid-sealing Solutions

Optical Transparent Sealing And Electronic Lid Seals

This series of advanced novel low temperature curing sealing solutions offer unparalleled moisture barrier and low stress protection to electronics and other devices for the extreme working environments.

The low thermal expansion coefficient (CTE) ensures low stress interface bonding between the covers, lids and protective surfaces when matched against metals, ceramics and glasses. They are ideal for sealing optical devices such CMOS camera and LED lighting devices.

The tight inter-penetrating network and the high glass transition of beyond 240°C formed by the cured sealing adhesives provide outstanding moisture barrier and protection against moisture even at saturating moisture and boiling water environments.

CMOS Device

AI Technology also formulated sealing solutions in the form of:
Thixotropic Pastes: To ensure controlled flow for confined and defined lid and cover sealing applications.
Low Viscosity Wicking Liquids: To ensure capillary flow capability to enable sealing large areas and difficult to apply interfaces.
This engineered capillary flow property also enables filling into crevices and form self-leveling covers for optical and electronic protections.
Self-Leveling Sealing Preforms: To provide high volume controlled manufacturing environment for optical and electronic devices.

Electronic Lid Seals And Environmetal Seals

AIT Part #	Dispensing Guidelines	Curing Guidelines	Tg (Glass Transition Temperature)	CTE (ppm/°C)	Gross & Fine Leaks
MC 7883	Dispense on covers or devices to be sealed Provide for adhesive flow during curing	150°C for 30 min 175°C for 3 min 200°C for 6 sec	240°C	20	Pass
MC 7880	Dispense only minimal amount of the low viscosity liquid Provide for adhesive flow during curing	150°C for 30 min 175°C for 3 min 200°C for 6 sec	240°C	30	Pass
MC 8880	Dispense on covers or devices to be sealed Provide for adhesive flow during curing	150°C for 30 min 175°C for 3 min 200°C for 6 sec	240°C	25	Pass

Lid Seal Application Guidelines:
Dispense onto perimeter cover to be placed as seal (preferred)
Provide for pre-heating of devices to be sealed to prevent air expansion blow out

AIT Part #	Dispensing Guidelines	Curing Guidelines	Tg (Glass Transition Temperature)	CTE (ppm/°C)	Gross & Fine Leaks
MC 3800	Dispense only minimal amount of the low viscosity liquid Provide for adhesive flow during curing	100°C for 90 min 125°C for 30 min 150°C for 10 min Do not cure or exposure to higher than 150°C	240°C	30	Pass
CXP 3880	Cut adhesive perform to size of cavity to be filled Provide for proper thickness to allow the perform to flow and fill the cavity	100°C for 90 min 125°C for 30 min 150°C for 10 min Do not cure or exposure to higher than 150°C	240°C	30	Pass

Optical Transparent Sealing Application Guidelines:

MC 3800 is a low viscosity liquid that is ideal for wicking into capillary to seal glass and other hard to get to interfaces. The coloured liquid will change to colourless transparent thin film as outstanding moisture barrier.

CXP 3800 is a self-levelling film that will flow under heat to fill into cavity. Provide for pre-heating of devices to be sealed to prevent air expansion blow out.

CONTACT US FOR Optical Transparent Sealing And Electronic Lid Seals

PRICE QUOTE - email us at sales@epakelectronics.com

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