Phone: +44 (0)1460 61791
Email: sales@epakelectronics.com

MIL-PRF883C 5011 Compliant Adhesives Epoxies and Films AI Technology

Many AiT products are available to Mil Std 883D as well as NASA & ESA outgassing qualification standards. Materials can be supplied in one or two part components, syringe, in pre-formed films, sheets in various sizes and in jars.

MIL-STD 883C METHOD 5011.4 QUALIFIED ADHESIVE PRODUCTS

Test Procedures: Mil-Std 883C Method 5011.4
Test Conditions: Per Specification
Tests Performed: 1989 to 1996
Acceptability: Both material characteristics and system level performances must meet requirements

(Click on the Product for the TDS.)

AIT Product

Characteristics

Electrical Resistivity
(ohm-cm)

Thermal
Conductivity

(watt/m-oC)

Die-shear

Tg (oC)
Flexible
Ambient storage
dry epoxy film
>1x1014
size="1">>1.7
>2,000
>-60
 1-component flexible
epoxy paste
>1x1014
>1.7
>1,000
-25
1-component flexible
epoxy paste
>1x1014 
 >1.7 >1,000  -25 
1-component flexible
epoxy paste
Diamond filled
>1x1014
>11.4
>1,000
-25
1-component rigid
epoxy paste
<5x10-4
>7.9
>2,000
130
1-component flexible
epoxy paste
<4x10-4
>7.9
>1,000
-20
1-component flexible
epoxy paste
<5x10-4
>5.7
>1,800
-25
1-component flexible
epoxy paste
 <4x10-4  >7.9   -20 
Tacky epoxy film
<5x10-4 
>6.4 
>2,400 
-25 
Dry thermoplastic film
<4x10-4 
>6.4 
 >900
-70 
Dry thermoplastic film
<4x10-4  
>6.4 
   >900 
-70 

CONTACT US FOR MIL-STD 883C METHOD 5011.4 QUALIFIED ADHESIVE PRODUCTS SELECTIONPRICE QUOTE - email us at sales@epakelectronics.com