Phone: +44 (0)1460 61791 Email: sales@epakelectronics.com
Management of heat dissipation in LED lighting device is critical for highest brightness and long-term performance. AIT has dedicated product developments with patented technologies that have proven to achieve the lowest thermal resistance from chip to heat-sink. The total material solutions help to have the lowest LED device temperature from die-attach to module sub-mounting and heat-sink interface.
With over 30 years of experience in inventing and formulating speciality adhesives for electronic applications, AIT provides one of the most comprehensive thermal interface solutions that are engineered to facilitate manufacturability and throughput:
Rapid curing electro-thermal LED die-attach pastes Compressible pressure sensitive thermal film that is industry best to provide instant bonding and lowest thermal resistance for large area LED sub-mounting Melt-bonding thermal adhesive that can be pre-applied for LED module sub-mounting and achieving full curing in-situ without applied pressure Conformal compressible phase change or pressure sensitive thermal interfaces for LED modules to heat-sink for largest displays
LED Die-Attach Adhesive, LED Submount Thermal Adhesive, LED Module Mounting Compressible Thermal Interface Phase-Change Pad
LED Die-Attach Adhesive with proven high Thermal Conductivity and Low Thermal Interface Resistance LED Submount and LED Module mounting Thermal Film Adhesive with Instant Melt-Bonding Compressible, Conformal Phase-Change Thermal Interface Pad for LED Heat-Sink Insulated Metal Thermal Substrate for Metal-Core Printed Wiring Board (MCPCB) with 2X Thermally Conductivity for LED Submout and LED Module
What distinguishes AIT LED total thermal management material solutions besides the unparalleled and proven low thermal resistance in the die-attach, sub-mount and heat-sink are the long-term reliability and consistent performance after years of thermal shock and cycling with the build-in stress relief, and molecular structures that are engineered to prevent “drying” or cracking inside the materials and along the interface surfaces.
Ultra-low electrical and thermal resistance between LED dies and sub-mount or substrate. High mechanical strength and glass transition temperature to enable fast wiring bonding as high as 275°C. For sub-mounting, molecular flexibility is specifically engineered in the thermal adhesive to provide stress absorption even in the most mis-matched CTE substrates and surfaces that extend to below -55°C. Depending on the assembly process, LED sub-mounting has a choice of novel and the only proven pressure sensitive thermal adhesive or a melt-bonding thermal adhesive film. In the heat-sink interface layer, AIT provides the patented and proven compressible and conformable interface pad to eliminate trapped air and accommodate irregularity in gap that need to be filled. Ultra-low moisture absorption and sensitivity RoHS, REACH and WEEE compliant that meets UL94V-0 rating.
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PROPERTY/PARAMETER |
ME 8512 |
ME 8638-UT |
ME 7519-LB |
|
Electrical Resistivity |
<0.0003 ohm-cm |
<0.0003 ohm-cm |
>10¹⁴ ohm-cm |
|
Viscosity @5.0 rpm/Thixotropic Index |
10,000 cps/4.0 |
10,000 cps/4.0 |
20,000cps/>3 |
|
Glass Transition Temperature (°C) |
52 |
90 |
52 |
|
Device Push-off Strength (psi) |
>3000 |
>3000 |
>3000 |
|
Hardness (Type) |
~ 80 |
~ 90 |
~ 85 |
|
Cured Density of Conductive Adhesive Portion (gm/cc) |
4.0 |
4.6 |
2.5 |
|
Thermal Conductivity |
> 12.0 W/m-°K |
> 12.0 W/m-°K |
> 12.0 W/m-°K |
|
Linear Tab-Composite Thermal Expansion Coefficient (ppm/°C) |
40 (X-Y=Z, Isotropic) |
38 (X-Y=Z, Isotropic) |
45 (X-Y=Z, Isotropic) |
|
Maximum Continuous Operation Temperature (°C) |
> 180 |
> 180 |
> 180 |
|
Decomposition Temperature @5% weight loss (°C) |
>450 |
>450 |
>450 |
|
Recommended Curing Temperature/Time (°C/min.) |
>175/10 |
>175/10 |
>175/10 |
Instant Bonding Compressible Pressure Sensitive Adhesive Pad Melt-tacking and In-situ Curable Low Thermal Resistance Film Adhesive Proven Lower LED Junction and Device Temperature for Higher Brightness
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Module Sub-Mounting Thermal Adhesives |
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|
PROPERTY/PARAMETER |
RTK 7555 |
RTK 7554 |
ME 7519-LB |
|
Thermal Conductivity |
> 0.2 W/m-°C |
> 0.2 W/m-°C |
> 0.2 W/m-°C |
|
Dielectric Strength (Volts/mil) |
>550 |
>300 |
>750 |
|
Device Push-off Strength (psi) |
>1000 |
>1000 |
>1000 |
|
Cured Density (gm/cc) |
2.5 |
2.5 |
2.5 |
|
Thermal Conductivity |
> 3.0 W/m-°C |
> 8.0 W/m-°C |
> 12 W/m-°C |
|
Maximum Continuous Operation Temp. (°C) |
> 150 |
> 150 |
> 150 |
|
Electrical Resistivity |
>10¹⁴ ohm-cm |
>10¹⁴ ohm-cm |
>10¹⁴ ohm-cm |
Compressible and conformal couples with phase change to allow elimination of voids Proven for most stringent applications including military applications US patented innovation Non-silicone and non-contaminating
Compressible and conformal Proven for large area requiring thermal filling into height gaps of different components Ideal for large area display and module to device enclosure Proven and used for most critical thermal challenges with military grade reliability Non-silicone and non-contaminating Available with different thickness with one-side or both side pressure sensitive
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Other AIT Thermal Interface Materials for HB LED Applications |
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FUNCTION |
AIT PART # |
THERMAL, ELECTRICAL AND OTHER RELEVANT PROPERTIES |
|
Compressible Phase-Change |
COOL-SILVER™ PAD CPR8850-LB |
|
|
Compressible Phase-Change |
COOL-SILVER™ G3 PAD |
|
|
Compressible Phase-Change |
COOL-PAD™ CPR7158 |
|
|
Compressible Phase-Change |
COOL-PAD™ CPR7155-LB |
|
|
Gap-Filling Thermal Pad |
COOL-GAPFILL™ DT, TT |
|
|
Compressible Gel-Film |
COOL-GELFILM™ SZ |
|
|
Thermal Grease |
COOL-SILVER™ G3 Grease |
|
|
Thermal Grease |
COOL-GREASE™ CGR7559-LB |
|
|
Thermal Gel |
COOL-SILVER™ G3 Gel |
|
|
Electro-Grease |
COOL-GREASE™ CGR8550 |
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