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AIT COUPLER organic copper-clad laminate flexible circuit substrate and flexible circuit pre-preg material panels can be used to build one of the thinnest components and circuit boards with 40-50 micron dielectric over a 1/4 oz (9 micron) copper conductor.
Through-hole plating for two sided interconnections Hydrophobic with ultra low moisture absorption Low dielectric constant No volume limitation
AI Technology has developed a solderable, organic copper-clad laminate flexible circuit substrate materials that can be used at temperatures as high as 300°C. The standard flexible circuit material uses 1 oz copper on this non-polyimide proprietary molecularly flexible material for a total 3-mil thickness as flexible circuit substrate.
These flexible circuit materials are available with 1/4 or 3/8-oz copper for super fine-pitch flexible circuit applications of less than 1-mil line/spacing and via.
Proprietary organic copper-clad laminate material with low dielectric constant, 3.0 @ 1 KHz with less than 0.01 dielectric loss and high insulation strength (>1000VDC/3-mil thickness). Non-silicone and non-contaminating molecularly flexible dielectric layer. Withstands chemical etching and wet chemical treatments for all PWB/PCB processes. Maintains outstanding flexibility even at temperatures of as low as 40°C. Eliminates traditional polyimide flexible circuit material "measling" and other moisture induced degradation and reliability problems as usually associated with polyimide based circuit boards. Outstanding moisture resistance, less than 0.3%, while maintaining high electrical and mechanical performance. UL-94-V0 fire-retardant rating. Same circuit density and design rules as traditional FR-4 and BT board. Lower temperature multi-layer flexible circuit processing from as low as 125°C. Solderable flexible circuit applications at 50% of the traditional polyimide flexible circuit material substrate cost.
Organic copper-clad laminate substrate flexible circuit materials to replace polyimide and PTFE. Flex tape for area-array flexible circuit and interposer substrate. Flip-chip on flex with superfine pitches. Directly solderable flat and flexible jumpers. Flat and flexible cabling that can be used in class Solderable membrane switches and circuits. Roll-to-roll or panel processing. Available in rolls of various lengths and width.
AIT COUPLER™ organic copper-clad laminate flexible circuit substrate and flexible circuit pre-preg material panels can be handled in exactly the same method and infrastructure as commonly used in standard PWB and flex circuit.
1. Panel & Roll Material Handling
COOL-CLAD™ and COUPLER™ organic copper-clad laminate flexible circuit substrates can be stored in ambient conditions for at least 12 months. COUPLER™ flexible circuit pre-preg material can be stored in ambient conditions for at least 6 months.
2. Panel Prep Tooling/Registration Scrubbing Chemical Cleaning Base Metal Protection
3. Imaging Dry Film Application Wet Film Application Screened Image Application
4. Wet Chemistry Processing Etching Stripping Post Etch/Strip Clean
5. Solder Mask Application Screen, Spray or Curtain Coat Thermal Solder Mask UV Cured Solder Mask
6. Second Step Drill or Punch Punch Drill
7. Finishing Operation HASL OSP Tin Ni/Au
8. Finishing Fabrication Route Score Punch
| Characteristics | Unit | Conditioning | Typical Values | Specification | |
|---|---|---|---|---|---|
| Volume Resistivity | M&-cm | C-96/35/90 | 5X108~5X109 | 106 | |
| Surface Resistivity | M& | C-96/35/90 | 5X106~5X107 | 10t | |
| Permittivity 1 MHz | - | C-24/23/50 | 3.8-4.2 | 5.4 | |
| Loss Tangent 1 MHz | - | C-24/23/50 | 0/013-0.020 | 0.035 | |
| Arc Resistance | Sec | D-48/50 + D-0.5/23 | 100 | 60 | |
| Dielectric Breakdown | KV | D-48/50 | 45 | 40 | |
| Moisture Absorption | % | D-24/23 | 0.01-0.20 | 0.35 | |
| Flammability | - | C-24/23/50+E-24/125 | 94V0 | 94V0 | |
| Peel Strength 1oz | Lb/in | 288°C Solder Floating | 8 | 8 | |
| Thermal Stress | Sec | 288°C Solder Dipping | 600 | 300 | |
| Pressure Cooker (2 atm/120°C) | hr | hr | Sec | 288°C Solder Dipping | 300 |
| 1 hr | Sec | 288°C Solder Dipping | 300 | N/A | |
| 2 hr | Sec | 288°C Solder Dipping | 300 | N/A | |
| Flexural Strength | LW | psi | A | 6000 | 60000 (N/A, For Flex Circuit) |
| CW | psi | A | 5000 | 60000 (N/A, For Flex Circuit) | |
| Dimensional Stability X-Y Axis | % | E-0.5/170 | 0.01-0.020 | 0.050 | |
| Coefficient of Thermal Expansion | Z-axis below Tg | In/in/°C | TMA | 60 PPM | N/A |
| Z-axis above Tg | Z-axis above Tg | In/in/°C | TMA | 180 | N/A |
| Glass Transition Temperature | °C | DSC | -40 +/- 5 | N/A |
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