Phone: +44 (0)1460 61791 Email: sales@epakelectronics.com
We are the UK supplier for AI Technology who produce an extensive range of high quality epoxy, adhesive films, pastes, thermal interface materials, materials for die attach, encapsulation and potting compounds. Module assembly, PCB assembly, heat sink attach, LCD assembly & EMI, RFI EMP shielding, CoolPAD™, CoolGREASE™, CoolGEL™, materials for CPU & MCU thermal interfaces, Laser & IR device potting materials, MCM assembly adhesives, BGA & uBGA die attach adhesives, and overcoat potting materials, Flip-Chip Bumps & Thermal interface Flip-Chip Adhesives, and mis-matched CTE materials.
Many AiT products are available to Mil Std 883D as well as NASA & ESA outgassing qualification standards.
Materials from AiT can be supplied in one or two part components, syringe, in pre-formed films, sheets in various sizes and in jars.
Adhesives for automotive electronics manufacturing. Electro-Thermal & Dielectric-Thermal Die-Attach Thermal interface materials, gels and greases for automotive applications. Module Mounting and Sub-Mounting Thermal Adhesives Compressible Phase-Change Thermal Interface Pads
Automotive Electronic & Electrical Adhesives, Thermal Management Products and Thermal Interface Materials.
Conformal coating for electronic circuit board protection UV Blocking And Resistant Protection Coatings With Outstanding Moisture Barrier and Resistance Ultra Hydrophobic, Non-Hygroscopic, moisture Blocking Coatings for wiring boards and electronic devices. Anti-Static Masking Tape and Film Form Dispensing Masking Coating and Masking Gel for Masking and Protection in Conformal Coating Processes Wafer processing film and spin coating adhesives
Coatings & Protection Materials
Die attach and thermal interface materials for CPU, GPU, Memory Modules for laptops, tablets and mainframe computers to supercomputers and multi-core desktop computers
CPCM is the patented compressible phase-change material (CPCM) version of COOL-SILVER™ grease. That is, COOL-SILVER™ CPCM may cool your computer by as much as 4-8°C in over-clocking applications Compressible Phase-Change Thermal Interface Pads Compressible Thermal Gap Pad Thermal Interface Thermal Interface for the Ever More Powerful Graphic Processor Unit (GPU) Module COOL-SILVER™ CPU Grease COOL-TIME™ Thermal Material Cleaning Solution
CPU, GPU Cooling Materials
Provides high performance sealing and shielding that is both moisture and chemical resistant, Ideal for all RF, mobile communication applications. Custom Materials & Adhesives Large area and mis-match substrate film and paste adhesives Speciality coating for extreme moisture and temperatures Pressure-sensitive and curable coatings and adhesives UV curable film and paste adhesives and coatings Dry or pressure-sensitive epoxy film adhesives with different electrical, mechanical, thermal, and electromagnetic properties Dry or pressure-sensitive thermoplastic film adhesives with different electrical, mechanical, thermal, and electromagnetic properties Speciality polymer-based material solutions to meet your specific manufacturing and performance requirements
Custom Material Solutions.JPG "AI Technology Custom Adhesives, Epoxies and Thermal Gels, Thermal Greases and Films")
AIT is the only manufacturer of dicing tapes that can withstand high temperature exposure. This unique ability to tolerate high temperatures is further enhanced with unique anti-static highly stretchable substrate. UV-release versions with different peel strengths are also available as well as Melt Bond Temporary tapes. AiT Dicing & Lapping Tapes Dicing & Grinding Tapes
Dicing, Lapping and Grinding Tapes
A range of flexible epoxy, thermosetting or thermoplastic materials for COB, MCM, TAB, LSI plastic, LSI ceramic, VLSI plastic, VLSI ceramic die attach.AIT has many proven epoxy paste adhesives for thermal management in component and substrate attachment. AiT Die Attach Materials Die Attach Pastes Die Attach Films Substrate and Component Attach Substrate Film Adhesives Component & Substrate Paste Adhesives Die, Substrate and Component Attach Materials
Die, Substrate and Component Attach Materials
Conductive, corrosion resistant, silicone and polymer based adhesives with a wide variety of fillers which include, silver, gold, diamond, copper, aluminium etc. EMI/RFI Compressible Gasket Sheet Materials Shielding Caulks and Adhesives Melt-Bonding Lid-Shield ESD Protection Coatings & Materials EMI Shielding Tips and FAQs
EMI, RFI and ESD Shielding and Protection
Flexible advanced circuit substrate materials COUPLER™ Flexible Circuit Material Solderable Flexible Circuit Materials For Fine-Pitch And Super-Fine Pitch Flexible Circuit Applications Solderable Flexible 1 and 2-Sided Copper Laminate Flexible Circuit Substrate Materials Flexible Pre-Preg for Flex Circuits and Interposers Flexible Pre-Preg for Power and LED Modules
Flex Circuit Materials
LED Thermal Interface Materials and materials for LED manufacturing
LED Die-Attach Adhesive with proven high Thermal Conductivity and Low Thermal Interface Resistance LED Submount and LED Module mounting Thermal Film Adhesive with Instant Melt-Bonding Compressible, Conformal Phase-Change Thermal Interface Pad for LED Heat-Sink Insulated Metal Thermal Substrate for Metal-Core Printed Wiring Board (MCPCB) with 2X Thermally Conductivity for LED Submout and LED Module
LED Materials
An extensive selection of materials, providing flexible and re-workable thermosetting epoxy films and pre-forms for lid, substrate, heat sink and die attach. Solderable Insulating Lids Lid seal materials Lid Attach Dispensable Insulating and Conductive Adhesives Solderable Ceramic, Glass and LCP Lids Pre-Applied Adhesive Preforms EMI Shielding Covers, Lids, and Caps without soldering SNAP-LID® Adhesive Preform Pre-application COOL-LID® Lid Attach to Combine with Thermal Management LID-SEAL: Low Cost Sealing, Thermal & Shielding Solutions
Lid Seal Solutions
Proven and qualified adhesives for die, component, and substrate attach applications. MIL-STD 883C Method 5011.4 Qualified Adhesive Products
Test Procedures: Mil-Std 883C Method 5011.4 Test Conditions: Per Specification Acceptability: Both material characteristics and system level performances must meet requirements ESP8350 FlexibleAmbient storagedry epoxy film ME7155 1-component flexibleepoxy paste ME7156-NG 1-component flexibleepoxy paste ME7159 1-component flexibleepoxy pasteDiamond filled ME8412 1-component rigidepoxy paste ME8456 1-component flexibleepoxy paste ME8456-GE 1-component flexibleepoxy paste ME8456-00 1-component flexibleepoxy paste TC8750 Tacky epoxy film TP8550 Dry thermoplastic film TP8650 Dry thermoplastic film
MIL-STD 883C 5011.4 Compliant Materials
AiT have a list of products from AIT that has years of proven success in NASA and ESA outgassing compliant adhesives for space applications. NASA-ESA Outgassing Qualified Products:
Test Procedures: ESA: PSS-01-792; NASA: ASTM E595-90 Test Conditions: 125OC for 24 hours @ 10-3 Pa (<10-5 Torr) Acceptability: Total Mass Loss (TML) <1% Volatile Condensable Materials (CVCM) <0.1% Water Vapor Regained (WVR) NR AIT Product: EG7635 EG7635 EG7655 EG8050 EG8050-HC ME7155 ESP8350 RTK7659 TC8750 TC8750 TK7755 Epoxy Foil Sandwich TP7205 TP7209 TP8205 Note: Most Adhesives made by AIT will pass NASA requirements. Please call AIT or fill out our contact form to find a material for your specific need.
NASA Outgassing Compliant Materials
AiT Opto-Bond™ is a range of products designed for the fibre optic / optoelectronic components manufacturing arena, all are UV curable.
Optical and Optoelectronic Materials
AiT Solar Solutions - solar panel manufacturing materials
SOLAR-IMB™ Thermally Conductive Insulated Metal Back Sheet Thermally Conductive Back Sheet Lowers Cell Temperature for Higher Efficiency Thermally Conductive Insulated Metal Back Sheet
SOLAR-THRU™ Encapsulation Transparent Front Sheet PVDF Encapsulating Transparent Front Sheet for Proven Performance Proven UV Resistant Encapsulating Transparent Front Sheet
SOLAR-TAB™ Lower Temperature Tabbing Interconnection
Solar Panel Materials
A range of materials that have been specifically designed to draw heat from the die or device to the heat sink, included are Cool-PAD™, Cool-GREASE™, Cool-GEL™, Cool-LID™, Cool-BOND™ AiT Thermal Interface Materials & Insulated Metal Substrates Compressible Phase-Change Interfaces Thermal Film and Paste Adhesives Thermal Gels & Greases LED Thermal Interface Materials Thermal Interface Materials for CPU, GPU and Memory Insulated Metal Substrate Copper Clads & Pre-Preg
Thermal Management Materials
Chip and component protection underfill & encapsulation materials Liquid Underfills with Ultra-high Glass Transition (Tg) High Melt-Flow Film Underfill for FOW Underfill Liquids and Film Adhesives
Underfill and Encapsulation Materials
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