While typical aspects of die-attach, component attach, substrate attach and thermal management are the same for all of the automotive electronics, automotive electronics operational temperature tends to be a lot higher and conditions a lot harsher.

The temperatures of power electronics like insulated gate bipolar transistors (IGBTs) can operate around 150C. Some electronics may be exposed to solvents (fuels) and other chemicals.

AI Technology have over 30 years of experience in inventing and formulating speciality adhesives for electronic applications, AIT provides one of the most comprehensive thermal interface solutions that are engineered to facilitate manufacturability and throughput:

High thermal automotive power electronic die-attach pastes
Compressible pressure sensitive thermal tape and thermal film adhesives that have been proven industry best to provide instant bonding and lowest thermal resistance for large area module mounting
Conformal compressible phase change or pressure sensitive thermal interfaces for modules to heat-sink thermal interface for largest displays
Camber-free insulated metal thermal substrate for metal-core printed wiring board (MCPWB) with measurable 2x better thermal conductivity

Automotive Electronic Adhesives & TIMs

AIT application engineering, sales, chemists, and material scientists are ready to serve your special needs and applications in electronics for automotive applications. Please inform us of your requirements using the Contact tab or click on the button below:

Adhesives and Thermal Interface Materials for Automotive Electronics

What distinguishes AIT automotive electronic adhesive and thermal management material solutions besides the unparalleled and proven low thermal resistance in the die-attach, module mounting and heat-sink thermal interfaces are the long-term reliability and consistent performance after years of thermal shock and cycling with the build-in stress relief, and molecular structures that are engineered to prevent “drying” or cracking inside the materials and along the interface surfaces.

Electro-Thermal & Dielectric-Thermal Die-Attach

Low Thermal Resistance for Higher Power Automotive Electronics
Modified Epoxy for camber-free Bonding
Maintain Stable Bond Strength for Extreme Thermal Shock and Cycling

Lowest Possible Die-Attach Thermal Interface is the Foundation of Automotive Power Electronics Thermal Management:

Die-Attach thermal management is the first and most critical layer of the thermal stacks in a power electronic and LED module devices. Highest thermal conductivity with thin and void-free bond-line of the die-attach adhesive is critical in dissipating the heat quickly to the broader sub-mount and eventually to the heat-sink.

Module Mounting and Sub-Mounting Thermal Adhesives

Extreme Thermal Adhesive for Module Mounting

Instant Bonding Compressible Pressure Sensitive Adhesive Pad
Melt-tacking and In-situ Curable Low Thermal Resistance Film Adhesive
Proven Lower Junction and Device Temperature

Compressible Phase-Change Thermal Interface Pads

Compressible and conformal couples with phase change to allow elimination of voids
Proven for most stringent applications including military applications
US patented innovation
Non-silicone and non-contaminating